EC26 Series
REGULATORY COMPLIANCE
2011/65 +
2015/863
191 SVHC
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
1.544MHz to 200MHz
Frequency Tolerance/Stability
Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range,
Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration
±100ppm Maximum
±50ppm Maximum
±20ppm Maximum
±25ppm Maximum
±5ppm/year Maximum
Aging at 25°C
Operating Temperature Range
-10°C to +70°C
-40°C to +85°C
Supply Voltage
3.3Vdc ±10%
Input Current
10mA Maximum over Nominal Frequency of 1.544MHz to 32MHz
18mA Maximum over Nominal Frequency of 32MHz to 50MHz
20mA Maximum over Nominal Frequency of 50.000001MHz to 70MHz
40mA Maximum over Nominal Frequency of 70.000001MHz to 125MHz
60mA Maximum over Nominal Frequency of 125.000001MHz to 200MHz
IOH = -8mA
90% of Vdd Minimum
Output Voltage Logic High (VOH)
Output Voltage Logic Low (VOL)
Rise/Fall Time
IOL = +8mA
10% of Vdd Maximum
Measured at 20% to 80% of waveform
5nSec Maximum (w/15pF Load), 7nSec Maximum (w/30pF Load) over Nominal Frequency of 1.544MHz to 35MHz
3nSec Maximum over Nominal Frequency of 35.000001MHz to 165MHz
2nSec Maximum over Nominal Frequency of 165.000001MHz to 200MHz
Duty Cycle
Measured at 50% of waveform
50 ±10(%)
50 ±5(%)
Load Drive Capability
Output Logic Type
30pF Maximum over Nominal Frequency of 1.544MHz to 35MHz
15pF Maximum over Nominal Frequency of 35.0000001MHz to 200MHz
CMOS
Pin 1 Connection
Tri-State (High Impedance)
Output Control Input Voltage Logic
High (Vih)
Output Control Input Voltage Logic
Low (Vil)
Standby Current
70% of Vdd Minimum or No Connect to Enable Output.
30% of Vdd Maximum to Disable Output (High Impedance)
Start Up Time
Disabled Output, High Impedance
10µA Maximum
12kHz to 20MHz offset frequency
1pSec Maximum
10mSec Maximum
Storage Temperature Range
-55°C to +125°C
RMS Phase Jitter
Revised W: 6/1/2015
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EC26 Series
PART NUMBERING GUIDE
Revised W: 6/1/2015
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EC26 Series
MECHANICAL DIMENSIONS
SUGGESTED SOLDER PAD LAYOUT
PIN
CONNECTION
1
Tri-State
2
Case/Ground
3
Output
4
Supply Voltage
All Tolerances are ±0.1
All Dimensions in Millimeters
Revised W: 6/1/2015
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EC26 Series
OUTPUT WAVEFORM & TIMING DIAGRAM
Revised W: 6/1/2015
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EC26 Series
TEST CIRCUIT FOR CMOS OUTPUT
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass
Capacitor close to the package ground pin is required.
Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz)
Passive probe is recommended.
Note 3: Capacitance value (CL) includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive
Capability’.
Revised W: 6/1/2015
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EC26 Series
TAPE & REEL DIMENSIONS
Quantity per Reel: 1,000 Units
All Dimensions in Millimeters
Compliant to EIA-481
Revised W: 6/1/2015
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EC26 Series
RECOMMENDED SOLDER REFLOW METHOD
HIGH TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (tS)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
3°C/Second Maximum
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
Target Peak Temperature(TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
217°C
60 - 150 Seconds
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised W: 6/1/2015
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EC26 Series
RECOMMENDED SOLDER REFLOW METHOD
LOW TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
5°C/Second Maximum
Preheat
- Temperature Minimum (Ts MIN)
- Temperature Typical (Ts TYP)
- Temperature Maximum(Ts MAX)
- Time (ts)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
5°C/Second Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
240°C Maximum 2 Times / 230˚C Maximum 1 Time
Time within 5°C of actual peak (tp)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
150°C
200 Seconds Maximum
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised W: 6/1/2015
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EC2620TS-50.000M TR 价格&库存
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- 国内价格
- 250+11.63226
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